Current Opening (Posted on June 4th 2010)

Engineer for high end semiconductor Equipment maintenance (like Sputter, PECVD, RIE, Dicing and Flip Chip Bonder)
Minimum qualification: M.Tech or B.Tech with 2 years of experience in relevant field.
Should have experience on working with Semiconductor equipments.
Minimum three year of attachment is required
For training in Europe and USA on various equipments, soon after joining.
Working in healthy environment with highly qualified persons

Salary: 4-7 Lacs per annum + Bonus (Negotiable if person has good experience)
Location: Bombay. He may require traveling as per requirement.
Joining will be in August 2010.

First two round of Telephonic interview. After that there will be final interview in Bombay.