Substrate size from pieces to 150 mm diameter Manual X, Y and theta alignment stage Vacuum / Pressure contact exposure modes Optical Splitfield and CCTV microscope options Simple, topside mask loading Low maintenance.
Available Options:
• Infrared (IR) back side alignment
• Large gap alignment
• UV / NUV / DUV exposure optics
• Carousel load

Features and technical specifications…….

Multiple contact & proximity exposure modes, Wafer size from pieces to 200 mm diameter, Square substrate up to 7x7 Optical and CCTV splitfield microscope options Simple topside mask loading Manual tray loading feature and Modular design, easily configurable for wide variety of applications with available options:
• Robotic autoload handling
• Automatic alignment
• Optical (OBS) and Infrared (IR) backside alignment
• Large gap alignment
• UV / NUV / DUV Exposure optics

Features and technical specifications…….

A unique machine with single and double-sided exposure capability. Designed specifically for single mask level applications and/or gross geometries and non-critical alignment - current applications include power devices, LEDs and MEMs applications. R&D and production applications, Manual loading of substrates, Single-side and double-side exposure capability, and Small pieces to 200 mm diameter substrate size

Available Options:
• CCTV Microscope
• Manual X, Y and theta alignment stage

Features and technical specifications…….

Projection Alignment - 72 WPH
• Temperature Control
• Thermal/Pneumatic Distortion Control
• 1X Scanning
• Mask Changer (Optional)
NEUTRONIX combines the expertise of component manufacturing and complete systems knowledge in providing you with the highest quality remanufactured equipment available.
• Wafer Sizes: 3" to 6" Semi Spec
• Wafer Feed: Dual Cassette, Auto Feeder
• Alignment: Manual / Automatic
• Resolution: 1.5um CD with Depth-Of-Focus +-6

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

- Clean room apparels

- Gloves - Vinyl, Nitrile, Letex

- Lint free wipes

- Clean room mats

- ESD clean room stationary

- UV protection gear - face shield, gloves, apparels.

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

UniLab is an instrument for extremely precise weighing of individual micro-particles. Furthermore, this device can be applied for the measurement of surface tension in thin films and adsorbed layers.

Features and technical specifications…….

X-AMIN PCX, laboratory scale phase contrast optimised x-ray system for 2D imaging and 3D tomography.

The PCX is the only commercial in-line laboratory scale phase contrast X-ray system available today. A number of source configurations are available providing either 4 micron or 1 micron resolution. Using XRT's patented imaging technology, including an X-ray source of high lateral spacial coherence, proven phase retrieval software and a high resolution large array detector, PCX may be configured to acquire absorption images, phase and absorption images, or images with a very pronounced phase signature. Phase plays a large part in producing images of high contrast - particularly from structures which are weakly absorbing and thus not amenable to imaging by conventional X-ray techniques. 

Features and technical specifications…….

TriA-SNOM
An Aperture SNOM microscope, capable of collecting optical signal in reflection, transmission and back-reflection modes. An instrument for surface science, optics and biology researchers who need a basic microscope easily expandable and interfaciable with their scientific equipment.

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

Features and technical specifications…….

The laser doppler vibrometer measure a surface vibration with sub-angstrom resolution and a 2MHz bandwidth. The measurement principle is to detect the frequency shift of the reflected light of a laser beam. Applications are resonant frequencies measurement, damping factors, vibration phase, mode coupling, studies, frequency shift vs temperature or ageing. The measurement system is composed of one electronic module and one optical module.

The optical module is available as a stand alone module. A fiber optic output allows measurement in any position of the laser beam. Light is emitted and collected through a small collimator. The laser doppler vibrometer is connected to a computer with a software module allowing broadband analysis of the vibration spectrum (peak detection, quality factors), file input/output, multiple averaging, transient recording.

The optical module is also available for integration into the ZoomSurf 3D microscope. The ZoomSurf 3D is a full 3D surface shape and vibration mode shape measurement system. The laser doppler module add highly sensitive frequency response and transient response measurement capability. System operation take advantage of the motorized translation stage and of the high level of automation of the ZoomSurf system.

Features and technical specifications…….

Tetreon manufactures the full range of 'Thermco' four stack furnaces, suitable for 75-200mm wafer processing utilising the industry leading TMX control system. All major atmospheric and LPCVD processes are supported. We can also provide systems for R&D or production applications where space and footprint is critical.

* Models 4500, 4900, 5100 and 5200 standard systems with 3 or 5 zone temperature control, providing a 30" or 40" flat zone
* Model 6200 ACFM system with special auto-locating elements and other automation compatible features
* Series 4000 & 5000 load stations providing an ultra clean loading environment [class 10]
* All major atmospheric and LPCVD processes are supported, and systems can be supplied with process guarantees
* Thermco systems are the most widely installed horizontal furnaces for production at 150mm and below, and are used by most major semiconductor manufacturers

Features and technical specifications…….

The Semitherm VTP 1500X is an outstanding vertical diffusion system for the processing of wafers up to 200mm:

* Process parameters are controlled by a new system developed from the industry leading TMX controller, the de facto standard for horizontal furnace systems
* Efficient and robust automation utilising industry standard robotics and a pneumatically operated jar/element lift mechanism
* A process tube replacement time of < 15 minutes means the element can remain hot and removes the need for reprofiling
* High throughput using three tower load/unload system
* Space efficient with a footprint of < 2 square metres, and < 2.8 metres tall
* Configurations available for most applications including wet & dry oxidation, anneal, LPCVD, ultra thin gate dialectric, ultra low temp anneal for BEOL, and ultra low temp LCVD

Features and technical specifications…….

Analyze Anti-Reflection Coatings and Hardcoats on Lenses Easily and Affordably
The F10-AR is the first instrument designed for simple, affordable testing of ophthalmic anti-reflection coatings. Available at a fraction of the cost of most instruments in use today, it contains several proprietary advances that allow line operators to make conclusive readings in seconds, and with only minutes of training.
Minimum, maximum, and average reflectance can be go/no-go tested over any number of user-defined wavelength ranges.
A special algorithm allows for the correction of localized reflectance distortions caused by hardcoat layers. Our proprietary AutoBaseline feature results in vastly increased baseline intervals and fives-times better accuracy than other fiber-probe-based reflectance instruments.
Hardcoat thickness 0.25-15um can be measured with our optional UPG-F10-AR-HC software upgrade. Hardcoat thickness even in the presence of AR layers are no problem.
No Backside Preparation Necessary
Our exclusive probe design rejects 98% of backside reflections on substrates 1.5mm thick, and rejects even more on thicker lenses.
Like all of our tabletop instruments, the F10-AR connects to the USB port of your Windows computer and sets up in minutes.

Features and technical specifications…….

Measure Reflectance and Transmittance Simultaneously
Designed with vacuum coaters in mind, the F10-VC captures reflectance and transmittance spectra with a single mouse click. For a fraction of the price of legacy systems, users can analyze min/max, determine FWHM, and do color analysis.
Optional thickness and index-solving modules provide access to all of the analytical power of the Filmetrics F20. Data can be exported and printed easily for fast distribution.
A laptop and 2-year warranty are provided with the system, making the F10-VC a complete, turn-key package.

Features and technical specifications…….

Measure films up to 500um thick
The Filmetrics F20-XT is optimized to measure thick films. Measuring films greater than 50 microns presents a unique challenge because of the high optical thickness often encountered (optical thickness = physical thickness x index). Some films, such as silicon, also become opaque in the visible wavelengths when thicker than a few microns.
To overcome these challenges, the F20-XT, based on the F20-NIR platform, contains a 512-element InGaAs spectrometer. Covering a wavelength range of 1400-1650 nm, this system maintains a 0.5 nm wavelength resolution in the NIR region, enabling it to detect thicker films more effectively than other optical-based systems. Like all of our tabletop instruments, the F20-XT connects to the USB port of your Windows computer and sets up in minutes.

Features and technical specifications…….

The Most Powerful Tool Available forMonitoring Thin-Film Deposition
Measure deposition rates, layer thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system.

Example Layers
MBE and MOCVD: Smooth and translucent, or lightly absorbing films, may be measured. This includes virtually any semiconducting material, from AIGaN to GaInAsP.
Benefits
»  Dramatically improves productivity
»  Low cost — Can pay for itself in months
»  Accurate — Measure to better than ±1%
»  Fast—Measurements in seconds
»  Non-Invasive — Totally outside of deposition chamber
»  Easy to use — Intuitive Windows™ software
»  Turn-key system sets up in minutes
Common Optional Accessories
»  Laptop computer pre-loaded with FILMeasure software
»  Lens Assemblies

Features and technical specifications…….

Turn Your Microscope into a Thin-Film Measurement Tool

The F40 product family is for applications that require a spot size as small as 2.5 microns. For most microscopes the F40 simply attaches to the c-mount adapter, which is the industry standard for video camera mounting.
The F40 comes complete with an integrated color video camera that allows exact monitoring of the measurement spot. Thickness and index can be measured in less than a second. Like all of our tabletop instruments, the F40 connects to the USB port of your Windows computer and sets up in minutes.

Common Applications
»  Displays
»  Stent passivation and drug-delivery coatings
»  Semiconductors

The three different F40 models each cover a different wavelength range. Generally longer wavelengths allow measurement of thicker, rougher, and more opaque films.

Features and technical specifications…….

High-Resolution Thickness Maps of Microscopic Areas
The Filmetrics F42 can map the thickness of over one-million points, each with a spot size as small as 3 microns. Using an integrated CCD camera, live video makes it easy to pinpoint exact measurement locations. Once the feature is in the field of view, simply draw a box around it to analyze it.
Pixel-Width Spot Size
A thickness measurement is made at every single pixel on the screen, yielding spot sizes as small as 3 microns. This allows measurements to be made in even the narrowest of channels and cavities.
Mapping
Uniformity can be checked on these structures with the F42 system’s mapping capability. With one click, over a million individual thicknesses can be calculated and displayed in an easy-to-read gradient map. Average thickness and other statistics are automatically reported while notifying the user of any out-of-range thickness measurements. Using goodness-of-fit criteria, the features of interest can be mapped while excluding all other areas.
Common Applications
»  Printed Circuit Boards
»  Semiconductor Fabrication
»  Liquid Crystal and OLED Displays

Features and technical specifications…….

Automated Mapping for Production Environments

The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples as large as 300mm in diameter. Map patterns can be polar, rectangular, or linear, or you can create your own with no limit on the number of measurement points. Dozens of pre-defined map patterns are supplied. The F50 tabletop system connects to the USB port of your Windows computer and can be set up in minutes.
The different F50 instruments are distinguished primarily by wavelength range. The standard F50 is the most popular. Generally shorter wavelengths (e.g. F50-UV) are required for thinner films, while longer wavelengths allow measurement of thicker, rougher, and more opaque films.

Features and technical specifications…….

Automated Mapping for Production Environments
The Filmetrics F60-t family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling.
The different F60-t instruments are distinguished primarily by wavelength range. Generally shorter wavelengths (e.g. F60-t-UV) are required for thinner films, while longer wavelengths allow measurement of thicker, rougher, and more opaque films.

Features and technical specifications…….

Product-Wafer Metrology Made Affordable
Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness Imaging™ technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools.
Unlike conventional metrology tools which measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location.
This revolutionary innovation results in...
»  Ultra-Fast Measurements - As Fast As 15 points in 21 seconds
»  Superior Ease of Use
»  More Robust Automation
»  Lower Cost than the Competitors

Configurations available from low-cost, manual load Table Top Systems to BOLTS Integrated Metrology Modules to fully automated Standalone Cassette-to-Cassette Systems If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been waiting for.

Features and technical specifications…….

Product-Wafer Metrology Made Affordable

Process engineers want film thickness measurements fast and without a lot of hassle. Our innovative Thickness ImagingTM technology allows Filmetrics to offer easy recipe set up, industry-leading throughput, and all at a mere fraction of the cost of competing metrology tools. Unlike conventional metrology tools which measure the thickness at a single spot, the F80 quickly generates a thickness image by collecting thousands of thickness readings in the vicinity of the measurement location. This revolutionary innovation results in...


»  Ultra-Fast Measurements - As Fast As 15 points in 21 seconds
»  Superior Ease of Use
»  More Robust Automation
»  Lower Cost than the Competitors

Configurations available from low-cost, manual load Table Top Systems to BOLTS Integrated Metrology Modules to fully automated Standalone Cassette-to-Cassette Systems If you are searching for the next generation in thickness metrology, then look no further than the Filmetrics F80. The F80 is the tool CMP, CVD, PVD and Wafer Track Process Engineers have been waiting for.

Features and technical specifications…….

Product-Wafer Metrology Combined With Wafer-Transfer in One Affordable Tool

Available exclusively through our partner Ricmar, the F80-a integrates full F80 functionality with Ricmar’s WTT 300 Wafer Transfer Tool. The result is dual-purpose functionality in a single affordable EFEM platform. Click here to read more about the F80-a on Ricmar’s site.

Features and technical specifications…….